Enhancing thermal conductivity of epoxy-based composites at low temperatures by Si3N4 binary fillersYue Xiang, Zhicong Miao, Zhixiong Wu, Huiming Liu, Chuanjun Huang, Zengchao Yang, Jiangtao Li, Rongjin Huang and Laifeng LiEur. Phys. J. Spec. Top., 234 30 (2026) 9687-9698DOI: https://doi.org/10.1140/epjs/s11734-025-01660-6