Effect of cooling rate on structure and creep behavior of Sn-0.7Cu-0.5Zn lead-free solder alloy E. S. Gouda Eur. Phys. J. Appl. Phys., 48 2 (2009) 20902 Published online: 17 September 2009 DOI: 10.1051/epjap/2009139
