EPJ

Measurement and prediction of contact angles of Pb-free Sn-Ag solder alloys on Cu substrate

A. M. Erer, E. Candan, M. H. Güven and Y. Turen

Eur. Phys. J. Appl. Phys., 54 1 (2011) 11302

Published online: 13 April 2011

DOI: 10.1051/epjap/2011100487

A. M. Erer

E. Candan

M. H. Güven

Y. Turen

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