EPJ

Role of humidity and surface roughness on direct wafer bonding

B. N. J. Persson and C. Mathew Mate

Eur. Phys. J. B, 97 4 (2024) 46

Published online: 17 April 2024

DOI: 10.1140/epjb/s10051-024-00680-w

B. N. J. Persson

C. Mathew Mate

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