A study of microstructural development, hardness and micro-creep of Sn-3.5Ag-0.7Cu lead-free solder alloy prepared by rapid solidification
Eur. Phys. J. Plus, 126 9 (2011) 84
Published online: 13 September 2011
DOI: 10.1140/epjp/i2011-11084-x