EPJ

Study on subsurface damage of wafer silicon containing through silicon via in thinning

Yixin Xu, Miaocao Wang, Fulong Zhu, Xiaojian Liu, Yuhong Liu and Liping He

Eur. Phys. J. Plus, 134 5 (2019) 234

Published online: 27 May 2019

DOI: 10.1140/epjp/i2019-12591-4

Yixin Xu

Miaocao Wang

Fulong Zhu

Xiaojian Liu

Yuhong Liu

Liping He

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