EPJ

Structural optimization of thermal stresses in BGA solder joints based on improved BP neural network-genetic algorithm

Haoyu Wang, Jianshe Ma, Mali Gong and Ping Su

Eur. Phys. J. Plus, 138 8 (2023) 712

Published online: 14 August 2023

DOI: 10.1140/epjp/s13360-023-04355-w

Haoyu Wang

Jianshe Ma

Mali Gong

Ping Su

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