EPJ

Embedded microneedle fin chip heat dissipation design and simulation

Zhiyuan Wu, Guo Ye, Jinsong Peng, Zhenzhi He and Xiangning Lu

Eur. Phys. J. Plus, 140 7 (2025) 685

Published online: 22 July 2025

DOI: 10.1140/epjp/s13360-025-06637-x

Zhiyuan Wu

Guo Ye

Jinsong Peng

Zhenzhi He

Xiangning Lu

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