Microstructure effects on thermal and electrical conductivities in the intermetallic compound Ag
Sn-based materials, sintered by SPS in view of die-attachment applications
, , , , , and
Eur. Phys. J. Spec. Top., 231 24 (2022) 4173-4178
Published online: 28 May 2022
DOI: 10.1140/epjs/s11734-022-00613-7