EPJ

Enhancing thermal conductivity of epoxy-based composites at low temperatures by Si₃N₄ binary fillers

Yue Xiang, Zhicong Miao, Zhixiong Wu, Huiming Liu, Chuanjun Huang, Zengchao Yang, Jiangtao Li, Rongjin Huang and Laifeng Li

Eur. Phys. J. Spec. Top., Publication ahead of print

Published online: 23 May 2025

DOI: 10.1140/epjs/s11734-025-01660-6

Yue Xiang

Zhicong Miao

Zhixiong Wu

Huiming Liu

Chuanjun Huang

Zengchao Yang

Jiangtao Li

Rongjin Huang

Laifeng Li

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