Atom chips in the real world: the effects of wire corrugation

T. Schumm, J. Estève, C. Figl, J.-B. Trebbia, C. Aussibal, H. Nguyen, D. Mailly, I. Bouchoule, C. I. Westbrook and A. Aspect
Eur. Phys. J. D, 32 2 (2005) 171-180
DOI: 10.1140/epjd/e2005-00016-x

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