EPJ ST Special Issue: Materials and Devices for Extreme Conditions

Details

Published on 26 August 2025

Guest Editors: Ai Du, Minjie Zhou, Jingquan Liu, Jianming Yang

The quest to understand the behaviours and performance of materials and devices under extreme conditions is a boundary-pushing venture that broadens the scope of human knowledge. Spanning the icy vacuum of space to the high-temperature and high-pressure core of a star, the field of materials and devices for extreme conditions emerges as a critical area of study. The focus lies in deciphering how materials and devices respond to extreme conditions, including, but not limited to, intense radiation, extreme cold, ultrahigh temperature, ultrahigh magnetic fields, and ultrahigh pressures, as well as the conditions induced by high-power lasers. This exploration delves into the physical effects and damage resulting from the interaction between different harsh environments and multidimensional, cross-scale material systems.

The composition, phase, structure or matter state transition, and the relative theories of these materials or devices in both dynamic and static conditions are of primary interest. Studies on materials and devices used to maintain, monitor, support, or assist the extreme conditions are also drawing significant attention. The work undertaken is not merely scientific; it is pioneering, delving into the unknown to reveal the secrets of materials capable of withstanding and thriving in environments that would destroy conventional materials. Research in this field is multifaceted, scrutinizing the intricate dynamics between materials and the forces that shape them.

The implications are far-reaching, affecting the design of more efficient aerospace components and the development of safer nuclear technologies. As new ground is broken, the field stands on the cusp of discoveries with the potential to revolutionize industries and usher in a new age of technological advancement. The pursuit continues, with each step forward promising to reshape the landscape of material science and engineering.

The main topics of this special issue include the following seven points:

• Interaction between intense radiation and materials or devices;
• Interaction between high-power lasers and materials or devices;
• The interaction of charged-particle radiations on materials as well as radiation damage studies on materials and semiconductor devices;
• Characteristics of materials or devices under extremely low temperatures and strong magnetic fields;
• Characteristics of materials or devices under ultra-high pressures;
• Preparation and fabrication of materials or devices for extreme condition;
• Other related research on materials and devices for extreme conditions.

The articles in this issue provide a snapshot of the current research on materials and devices for extreme conditions, providing a forward-looking perspective on the potential of this interdisciplinary arena. This research is a collaborative endeavour, bringing together material scientists, physicists, engineers, environmental scientists, mathematicians, data scientists, and policy experts in a shared pursuit of innovation and understanding.

Articles should be submitted to the Editorial Office of EPJ ST via the submission system, and should be clearly identified as intended for the topical issue “Materials and Devices for Extreme Conditions”.

More detailed author information including paper types can be found in the Submission Guidelines. For the preparation of the manuscripts a special latex template (preferably single-column layout) is available here.

Guest Editors:

Prof./Dr. Ai Du
School of Physics Science and Engineering, Tongji University, Shanghai 200092, China
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Prof./Dr. Minjie Zhou
Department of Materials and Engineering, Laser Fusion Research Center, China Academy of Engineering Physics, Mianyang 621900, China
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Prof./Dr. Jingquan Liu
School of Integrated Circuits (School of Information Science and Electronic l Engineering), Shanghai 200240, China
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Dr. Jianming Yang
School of Physics Science and Engineering, Tongji University, Shanghai 200092, China
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