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Ultra high barrier materials for encapsulation of flexible organic electronics

S. Logothetidis, A. Laskarakis, D. Georgiou, S. Amberg-Schwab, U. Weber, K. Noller, M. Schmidt, E. Küçükpinar-Niarchos and W. Lohwasser

Eur. Phys. J. Appl. Phys., 51 3 (2010) 33203

DOI: https://doi.org/10.1051/epjap/2010102

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