Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering dischargesV. Stranak, H. Wulff, R. Bogdanowicz, S. Drache, Z. Hubicka, M. Cada, M. Tichy and R. HipplerEur. Phys. J. D, 64 2-3 (2011) 427-435DOI: https://doi.org/10.1140/epjd/e2011-20393-7