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Heat treatment-induced bond layer diffusion and re-crystallization in copper carbon interface systems measured by modulated IR radiometry

S. Chotikaprakhan, A. Haj-Daoud, E. Neubauer, J. Pelzl, B. K. Bein and R. Meckenstock

Eur. Phys. J. Special Topics, 153 (2008) 391-394

DOI: https://doi.org/10.1140/epjst/e2008-00469-5

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